AD8284 datasheet(17/28 Pages) AD

17 / 28 page

Data Sheet

AD8284

Rev. D | Page 17 of 28

EXPOSED PAD THERMAL HEAT SLUG

RECOMMENDATIONS

It is required that the exposed pad on the underside of the

device be connected to a quiet analog ground to achieve the

best electrical and thermal performance of the AD8284. Mate

an exposed continuous copper plane on the PCB to the AD8284

exposed pad, Pin 0. The copper plane should have several vias

to achieve the lowest possible resistive thermal path for heat

dissipation to flow through the bottom of the PCB.

To maximize the coverage and adhesion between the device and

the PCB, it is recommended that the continuous copper pad be

partitioned by overlaying a silkscreen or solder mask to divide the

copper pad into uniform sections. This partitioning helps to ensure

several tie points between the PCB and the device during the reflow

process. Using one continuous plane with no partitions guarantees

only one tie point between the AD8284 and the PCB. For more

information about packaging and for additional PCB layout

examples, see the AN-772 Application Note.

AD8284 Datasheet(PDF) 17 Page - Analog Devices