ADC10321 datasheet(7/16 Pages) NSC

7 / 16 page

AC Electrical Characteristics (Continued)

The following specifications apply for V

A = +5.0VDC,VD I/O = 5.0VDC,VREF+ = +3.5VDC,VREF− = +1.5VDC,fCLK = 20MHz,

rc = tfc = 5ns, RS = 25Ω.CL (data bus loading) = 20 pF, Boldface limits apply for TA = TMIN to TMAX: all other limits TA =

25˚C(Note 7)

Symbol

Parameter

Conditions

Typical

(Note 8)

Limits

(Note 9)

Units

(Limits)

r,tf

Output Rise and Fall Times

Fall of CLK to data valid

ns(max)

Output Data Hold Time

DIS

Rising edge of OE to valid data

From output High,

2K to Ground

From output Low,

2K to V

D I/O

Falling edge of OE to valid data

1K to V

VALID

Data valid time

Aperture Jitter

<30

Full Scale Step Response

r = 10ns

conversion

Overrange Recovery Time

IN step from

REF+ +100mV) to

REF−)

conversion

PD low to 1/2 LSB accurate

conversion (Wake-Up time)

700

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-

tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci-

fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.

Note 3: When the input voltage at any pin exceeds the power supplies ( VIN < AGND or VIN > VA or VD), the current at that pin should be limited to 25mA. The 50mA

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25mA to two.

Note 4: The absolute maximum junction temperature (TJmax) for this device is 150˚C. The maximum allowable power dissipation is dictated by TJmax, the

junction-to-ambient thermal resistance (

θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX=(TJmax - TA)/θJA. In the 32-pin

TQFP,

θJA is 69˚C/W, so PDMAX = 1,811 mW at 25˚C and 942mW at the maximum operating ambient temperature of 85˚C. Note that the power dissipation of this

device under normal operation will typically be about 110mW (98mW quiescent power + 2mW reference ladder power +10mW due to 10 TTL load on each digital out-

put). The values for maximum power dissipation listed above will be reached only when the ADC10321 is operated in a severe fault condition (e.g. when input or out-

put pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.

Note 5: Human body model is 100 pF capacitor discharged through a 1.5k

Ω resistor. Machine model is 220 pF discharged through ZERO Ω.

Note 6: See AN450,

″Surface Mounting Methods and Their Effect on Product Reliability″, or the section entitled ″Surface Mount″ found in any post 1986 National

Semiconductor Linear Data Book, for other methods of soldering surface mount devices.

Note 7: The inputs are protected as shown below. Input voltage magnitudes up to 500mV beyond the supply rails will not damage this device. However, errors in

the A/D conversion can occur if the input goes above VA or below AGND by more than 300 mV.

Note 8: Typical figures are at TA = TJ = 25˚C, and represent most likely parametric norms.

Note 9: Tested limits are guaranteed to Nationsl’s AOQL (Average Outgoing Quality Level).

Note 10: When the input signal is between VREF+ and (VA + 300mV), the output code will be 3FFh, or all 1s. When the input signal is between −300 mV and VREF−,

the output code will be 000h, or all 0s.

DS100897-11

DS100897-12

DS100897-24

ADC10321 Datasheet(PDF) 7 Page - National Semiconductor (TI)

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