| Electronic Components Datasheet Search |
|
AD8033 Datasheet(PDF) 15 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
AD8033 Datasheet(HTML) 15 Page - Analog Devices |
|
15 / 20 page ![]() REV. B AD8033/AD8034 –15– LAYOUT, GROUNDING, AND BYPASSING CONSIDERATIONS Bypassing Power supply pins are actually inputs, and care must be taken so that a noise-free stable dc voltage is applied. The purpose of bypass capacitors is to create low impedances from the supply to ground at all frequencies, thereby shunting or filtering a majority of the noise. Decoupling schemes are designed to minimize the bypassing impedance at all frequencies with a parallel combination of capacitors. 0.01 µF or 0.001 µF (X7R or NPO) chip capacitors are critical and should be placed as close as possible to the amplifier package. Larger chip capacitors, such as the 0.1 µF capacitor, can be shared among a few closely spaced active components in the same signal path. The 10 µF tantalum capacitor is less critical for high frequency bypassing, and in most cases, only one per board is needed at the supply inputs. Grounding A ground plane layer is important in densely packed PC boards in order to spread the current, thereby minimizing parasitic induc- tances. However, an understanding of where the current flows in a circuit is critical to implementing effective high speed circuit design. The length of the current path is directly proportional to the magnitude of the parasitic inductances, and thus the high frequency impedance of the path. High speed currents in an inductive ground return will create unwanted voltage noise. The length of the high frequency bypass capacitor leads is most critical. A parasitic inductance in the bypass grounding will work against the low impedance created by the bypass capacitor. Place the ground leads of the bypass capacitors at the same physical location. Because load currents flow from the supplies as well, the ground for the load impedance should be at the same physical location as the bypass capacitor grounds. For the larger value capacitors that are intended to be effective at lower frequencies, the current return path distance is less critical. Leakage Currents Poor PC board layout, contaminants, and the board insulator material can create leakage currents that are much larger than the input bias currents of the AD8033/AD8034. Any voltage differential between the inputs and nearby runs will set up leakage currents through the PC board insulator, for example, 1 V/100 G Ω = 10 pA. Similarly, any contaminants on the board can create significant leakage (skin oils are a common problem). To significantly reduce leakages, put a guard ring (shield) around the inputs and input leads that are driven to the same voltage potential as the inputs. This way there is no voltage potential between the inputs and surrounding area to set up any leakage currents. For the guard ring to be completely effective, it must be driven by a relatively low impedance source and should completely surround the input leads on all sides, above, and below using a multilayer board. Another effect that can cause leakage currents is the charge absorption of the insulator material itself. Minimizing the amount of material between the input leads and the guard ring will help to reduce the absorption. Also, low absorption materials such as Teflon ® or ceramic may be necessary in some instances. Input Capacitance Along with bypassing and ground, high speed amplifiers can be sensitive to parasitic capacitance between the inputs and ground. A few pF of capacitance will reduce the input impedance at high frequencies, in turn increasing the amplifiers’ gain and causing peaking of the overall response or even oscillations if severe enough. It is recommended that the external passive components that are connected to the input pins be placed as close as possible to the inputs to avoid parasitic capacitance. The ground and power planes must be kept at a distance of at least 0.05 mm from the input pins on all layers of the board. APPLICATIONS High Speed Peak Detector The low input bias current and high bandwidth of the AD8033/ AD8034 make the parts ideal for a fast settling, low leakage peak detector. The classic fast-low leakage topology with a diode in the output is limited to 1.4 V p-p max in the case of the AD8033/AD8034 because of the protection diodes across the inputs, as depicted in Figure 4. AD8033/ AD8034 VIN ~1.4V p-p MAX VOUT Figure 4. High Speed Peak Detector with Limited Input Range |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |