THS4021 datasheet(17/29 Pages) TI1

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|VO| − RMS Output Voltage − V

100

120

140

160

180

200

G030

Package With

θJA < = 120°C/W

SO-8 Package

θJA = 167°C/W

Low-K Test PCB

VCC = ± 5 V

Tj = 150°C

TA = 50°C

Maximum Output

Current Limit Line

Safe Operating

Area

|VO| − RMS Output Voltage − V

G031

100

TJ = 150°C

TA = 50°C

VCC = ± 15 V

Maximum Output

Current Limit Line

SO-8 Package

θJA = 98°C/W

High-K Test PCB

DGN Package

θJA = 58.4°C/W

SO-8 Package

θJA = 167°C/W

Low-K Test PCB

Safe Operating

Area

THS4021

THS4022

SLOS265C – SEPTEMBER 1999 – REVISED JULY 2007

The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent

power and output power. The designer should never forget about the quiescent heat generated within the device,

especially with multiamplifier devices. Because these devices have linear output stages (Class A-B), most of the

heat dissipation is at low output voltages with high output currents. Figure 40 through Figure 43 show this effect,

along with the quiescent heat, with an ambient air temperature of 50

°C. Obviously, as the ambient temperature

increases, the limit lines shown drop accordingly. The area under each respective limit line is considered the safe

operating area. Any condition above this line exceeds the amplifier limits and failure may result. When using VCC

= ±5 V, there is generally not a heat problem, even with SOIC packages. But, when using VCC = ±15 V, the SOIC

package is severely limited in the amount of heat it can dissipate. The other key factor when looking at these

graphs is how the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat

dissipation. But the device should always be soldered to a copper plane to use fully the heat dissipation

properties of the thermal pad. The SOIC package, on the other hand, is highly dependent on how it is mounted

on the PCB. As more trace and copper area is placed around the device,

θJA decreases and the heat dissipation

capability increases. The currents and voltages shown in these graphs are for the total package. For the

dual-amplifier package (THS4022), the sum of the RMS output currents and voltages should be used to choose

the proper package. The graphs shown assume that both amplifier outputs are identical.

THS4021

MAXIMUM RMS OUTPUT CURRENT

RMS OUTPUT VOLTAGE DUE TO THERMAL LIMITS

Figure 40.

Figure 41.

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