Connection Diagram

Ordering Information

Ordering Number

Package Type

NSC Package Drawing

Supplied As

LM5102MM

MSOP-10

MUB10A

1000 shipped as Tape & Reel

LM5102MMX

MSOP-10

MUB10A

3500 shipped as Tape & Reel

LM5102SD

LLP-10

SDC10A

1000 shipped as Tape & Reel

LM5102SDX

LLP-10

SDC10A

4500 shipped as Tape & Reel

Pin Descriptions

Pin

Name

Description

Application Information

MSOP-10

LLP-10

11

V

DD

Positive gate drive supply

Locally decouple to V

close to IC as possible.

2

2

HB

High side gate driver

bootstrap rail

Connect the positive terminal of bootstrap capacitor to the HB pin

and connect negative terminal of bootstrap capacitor to HS. The

Bootstrap capacitor should be placed as close to IC as possible.

3

3

HO

High side gate driver

output

Connect to gate of high side MOSFET with short low inductance

path.

4

4

HS

High side MOSFET source

connection

Connect bootstrap capacitor negative terminal and source of high

side MOSFET.

5

5

RT1

High side output edge

delay programming

Resistor from RT1 to ground programs the leading edge delay of

the high side gate driver. The resistor should be placed close to the

IC to minimize noise coupling from adjacent traces.

6

6

RT2

Low side output edge

delay programming

Resistor from RT2 to ground programs the leading edge delay of

the low side gate driver. The resistor should be placed close to the

IC to minimize noise coupling from adjacent traces.

7

7

HI

High side driver control

input

TTL compatible thresholds. Unused inputs should be tied to ground

and not left open.

8

8

LI

Low side driver control

input

TTL compatible thresholds. Unused inputs should be tied to ground

and not left open.

99

V

SS

Ground return

All signals are referenced to this ground.

10

10

LO

Low side gate driver output Connect to the gate of the low side MOSFET with a short low

inductance path.

Note: For LLP-10 package, it is recommended that the exposed pad on the bottom of the LM5100 / LM5101 be soldered to ground plane on the PC board,

and the ground plane should extend out from beneath the IC to help dissipate the heat..

20088901

10-Lead MSOP, LLP

See NS Numbers MUB10A and SDC10A

FIGURE 2.

www.national.com

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