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THERMAL INFORMATION

TYPICAL APPLICATIONS

Vout

3.3V/0.6A

Vin

3.6V to 6.0V

VIN

VIN

EN

MODE

SW

FB

PGND

PGND

SW

GND

2

3

1

4

9

10

5

7

8

6

TPS62020

C3

10uF

C1

22pF

L1

3.3uH

C4

22uF

R2

110k

R1

620k

C2

150pF

C5

22uF

Vout

1.8V/0.6A

Vin

2.5V to 6.0V

VIN

EN

MODE

SW

FB

PGND

PGND

SW

GND

2

3

1

4

9

10

5

7

8

6

TPS62020

C3

10uF

C1

22pF

L1

6.8uH

C4

22uF

R2

240k

R1

620k

C2

68pF

VIN

Vout

1.2V/0.6A

Vin

2.5V to 6.0V

VIN

EN

MODE

SW

FB

PGND

PGND

SW

GND

2

3

1

4

9

10

5

7

8

6

TPS62020

C3

10uF

C1

33pF

L1

10uH

C4

10uF

R2

330k

R1

470k

C2

68pF

VIN

TPS62020, TPS62021

SLVS076B – JUNE 2003 – REVISED APRIL 2004

One of the most influential components on the thermal performance of a package is board design. In order to

take full advantage of the heat dissipating abilities of the PowerPAD™ packages, a board should be used that

acts similar to a heat sink and allows for the use of the exposed (and solderable), deep downset pad. For further

information please refer to Texas Instruments application note (SLMA002) PowerPAD Thermally Enhanced

Package.

The PowerPAD™ of the 10-pin MSOP package has an area of 1,52 mm

× 1,79 mm (±0,05 mm) and must be

soldered to the PCB to lower the thermal resistance. Thermal vias to the next layer further reduce the thermal

resistance.

Figure 17. Li-Ion to 3.3 V With Improved Load Transient Response

Figure 18. 1.8 V Output Using 6.8 µH Inductor

Figure 19. 1.2 V Output Using 10 µH Inductor

15