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DS2770 Datasheet(PDF) 13 Page - Dallas Semiconductor |
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DS2770 Datasheet(HTML) 13 Page - Dallas Semiconductor |
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13 / 27 page ![]() DS2770 13 of 27 MEMORY MAP Figure 11 ADDRESS (HEX) DESCRIPTION R/W 00 Reserved 01 Status Register R** 02 Elapsed Time Register MSB R/W 03 Elapsed Time Register LSB R/W 04 to 05 Reserved 06 Charge Time Register R/W 07 EEPROM Register R/W 08 to 0B Reserved 0C Voltage Register MSB R 0D Voltage Register LSB R 0E Current Register MSB R 0F Current Register LSB R 10 Accumulated Current Register MSB R/W 11 Accumulated Current Register LSB R/W 12 to 17 Reserved 18 Temperature Register MSB R 19 Temperature Register LSB R 1A to 1F Reserved 20 to 2F Lockable EEPROM Block 0 R/W* 30 to 3F Lockable EEPROM Block 1 (31 = Status Register Initialization) (32 to 33 = Current Offset Register) (34 = Charge Time Register Initialization) R/W* 40 to 47 Lockable EEPROM Block 2 R/W* 48 to 7F Reserved 80 to 8F General-Purpose SRAM R/W 90 to FF Reserved * The lockable EEPROM address locations 20h through 47h are writeable until locked by using the Lock function command [6Axxh], after which it is read only. ** The Status Register bits are read only. However, writing any byte value to the Status Register is required to clear a previous charge completion condition flagged with both CSTAT1, CSTAT0 bits set. STATUS REGISTER The default values for the Status Register are stored in lockable EEPROM in the corresponding bits of address 31h. These values in address location 31h are supplied directly to the Status Register (not from shadow RAM) on either a device power-up or upon execution of the Refresh command. Changes to the Status Register bits must be made to the EEPROM location 31h, and then use the Refresh command to recall the changes to the Status Register. Figure 12 shows the format of the Status Register. The function of each bit is described in detail in the following paragraphs. |
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