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LM2608 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM2608
Description  400mA Sub-miniature, High Efficiency, Programmable DC-DC Converter with Linear Mode
PDF  18 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2608 Datasheet(HTML) 5 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Specifications with standard typeface are for T
A =TJ = 25˚C, and those in bold face type apply over the full Operating Tem-
perature Range (T
A =TJ = −25˚C to +85˚C). Unless otherwise specified, PVIN = VDD = EN = SYNC = 3.6V, VSEL = 0V,
VREF = 1.35V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
SYNC_H
SYNC/MODE Positive
Going Threshold Voltage
0.85
1.3
V
V
SYNC_L
SYNC/MODE Negative
Going Threshold Voltage
0.4
0.80
V
V
SEL_H
V
SEL Positive Going
Threshold Voltage
0.80
1.3
V
V
SEL_L
V
SEL Negative Going
Threshold Voltage
0.4
0.75
V
I
SEL
VSEL Pull Down Current
VSEL = 1.2V
0.70
2
µA
I
REF
Input current into VREF pin
15
150
nA
f
sync
SYNC/MODE Clock
Frequency Range
(Note 9)
500
1000
kHz
F
OSC
Internal Oscillator
Frequency
LM2608ATL-1.3/1.8, PWM
Mode
510
610
690
kHz
T
min
Minimum ON-Time of P FET
Switch in PWM Mode
200
ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but parameter specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and
Conditions in the Electrical Characteristics table. Electrical Characteristics table limits are guaranteed by production testing, design or correlation using standard
Statistical Quality Control methods. Typical (Typ) specifications are mean or average values from characterization at 25˚C and are not guaranteed.
Note 2: Thermal shutdown will occur if the junction temperature exceeds the 150˚C maximum junction temperature of the device.
Note 3: Thermal resistance specified with 2 layer PCB(0.5/0.5 oz. cu).
Note 4: The LM2608 is designed for cell phone applications where turn-on after system power-up is controlled by the system processor and internal UVLO (Under
Voltage LockOut) circuitry is unnecessary. The LM2608 has no UVLO circuitry and should be kept in shutdown by holding the EN pin low until the input voltage
exceeds 2.8V. Although the LM2608 exhibits safe behavior while enabled at low input voltages, this is not guaranteed.
Note 5: The LM2608 PWM mode output voltage precision is ±1% when operating from an external 1.35V reference voltage.
Note 6: The hysteresis voltage is the minimum voltage swing on FB that causes the internal feedback and control circuitry to turn the internal PFET switch on and
then off, during test mode.
Note 7: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the output is pulled below about 0.7V, the internal PFET switch turns
off for 2.5 µs to allow the inductor current to diminish.
Note 8: EN is a Schmitt trigger digital input with logic thresholds that are independent of supply voltage at the VDD pin.
Note 9: SYNC driven with an external clock switching between VDD and GND. When an external clock is present at SYNC, the IC is forced into PWM mode at the
external clock frequency. The LM2608 synchronizes to the rising edge of the external clock.
www.national.com
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