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RN41 Datasheet(PDF) 11 Page - Microchip Technology

Part # RN41
Description  Class 1 Bluetooth Module with EDR Support
PDF  28 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

RN41 Datasheet(HTML) 11 Page - Microchip Technology

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 2014 Microchip Technology Inc.
DS50002280A-page 11
RN41/RN41N
Microchip offers HCI mode in two hardware interfaces:
• HCI over UART (RN41HCI-I/RM)
• HCI over USB (RN41U-I/RM)
2.6.1
HCI OVER UART
In this mode, the hardware interface between the host
processor and the Bluetooth module is the UART con-
figured at 115.2 Kbps. You must interface the flow con-
trol signals between the host processor and the
Bluetooth module for the HCI interface to work. Failure
to do so can cause the host processor and the Blue-
tooth module to become out of sync and break the
Bluetooth link.
2.6.2
HCI OVER USB
In this mode, the hardware interface between the host
processor and the Bluetooth module is the USB. In this
architecture, the Bluetooth module is the USB slave
and the host processor is the USB host.
Using the USB interface offers the advantage of a
faster data link between the Bluetooth module and the
host processor. With this architecture, it is possible to
achieve Bluetooth’s theoretical maximum throughput of
3 Mpbs.
2.7
Soldering Recommendations
The RN41/RN41N wireless module was assembled
using standard lead-free reflow profile IPC/JEDEC J-
STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
• Microchip Technology Application Note,” AN233
Solder Reflow Recommendation” (DS00233) pro-
vides solder reflow recommendations
• Do not exceed peak temperature (Tp) of 250 C°
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
2.8
SPI Interface
The SPI Interface is primarily used for factory test and
diagnostics. Although not required, the SPI interface is
useful for restoring a corrupted flash image or enabling
test modes required for certification testing.
When module is installed in a final product that requires
European type approval, see Section 3.3 “Europe”, it
is recommended that the SPI interface should be
accessible via 6-pin header as shown in Figure 2-6.
FIGURE 2-6:
OPTIONAL SPI
INTERFACE
2.9
Bluetooth SIG QDID
The RN41 has a QDID registered with the Bluetooth
SIG. The manufacturer using the RN41 module in their
end product can reference this QDID when filing an
EPL (end product listing) to use Bluetooth® brand and
logo. Please visit the Bluetooth SIG at
www.bluetooth.org for more information.
Declaration ID: B013180
QDID: 7786



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