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LM358FVT Datasheet(PDF) 27 Page - Rohm |
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LM358FVT Datasheet(HTML) 27 Page - Rohm |
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27 / 48 page  Datasheet www.rohm.com TSZ02201-0GMG0G200190-1-2 ©2015 ROHM Co., Ltd. All rights reserved. 27/44 01.Aug.2016 Rev.005 TSZ22111･15･001 LM358xxx LM324xxx LM2904xxx LM2902xxx 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 Ambient Temperature [°C] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 Ambient Temperature [°C] Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to rise above the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 67(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation (PD). θJA = (Tjmax－TA) / PD °C/W The Derating Curve in Figure 67(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figures 67(c) to (f) show the examples of derating curves for LM358xxx, LM2904xxx, LM324xxx, and LM2902xxx respectively. LM358FJ (Note 21) θJA=(Tjmax-TA)/ PD °C/W Ambient Temperature, TA [ °C ] Chip Surface Temperature, TJ [ °C ] (a) Thermal Resistance (b) Derating Curve Ambient Temperature, TA [ °C ] Power Dissipation of LSI [W] PDmax θJA2 < θJA1 0 50 75 100 125 150 25 P1 P2 θJA2 θJA1 Tjmax (c) LM358xxx LM358F (Note 20) 85 LM358FVT (Note 22) LM358FV (Note 22) LM358FVJ (Note 23) LM358FVM (Note 23) (d) LM2904xxx LM2904FVT (Note 22) LM2904FV (Note 22) LM2904FVJ(Note 23) LM2904FVM (Note 23) LM2904F (Note 20) LM2904FJ (Note 21) |
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