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LM2655 Datasheet(PDF) 10 Page - National Semiconductor (TI) |
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LM2655 Datasheet(HTML) 10 Page - National Semiconductor (TI) |
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10 / 16 page ![]() DESIGN PROCEDURE (Continued) TABLE 1. MOSFET Manufacturers Manufacturer Model Number Package Type www Address Phone Fax Fairchild Semiconductor FDC653N SuperSOT-6 www.fairchildsemi.com 888-522-5372 207-761-6020 General Semiconductor GF4420 SO-8 www.gensemi.com 631-847-3000 631-847-3236 International Rectifier IRF7807 SO-8 www.irf.com 310-322-3331 310-322-3332 Vishay Siliconix Si4812DY SO-8 www.vishay.com 800-554-5565 408-567-8995 Si4874DY SO-8 Zetex ZXM64N03X SO-8 www.zetex.com (44) 161-622-4422 (44) 161-622-4420 LOW-SIDE MOSFET SELECTION When operating in synchronous mode, special attention should be given to the selection of the low-side MOSFET. Besides choosing a MOSFET with minimal size and on resis- tance, it is critical that the MOSFET meet certain rise and fall time specifications. A 30ns deadtime between the low-side and high-side MOSFET switching transitions is programmed into the LM2655, as shown in Figure 1. The prevent shoot- through current, the low-side MOSFET must turn off before the high-side MOSFET turns on. Hence, the low-side MOS- FET has 30ns to turn off from the time the low-side driver goes low. The fall time of the low-side MOSFET is governed by the equation: I C =CIN*dVC/dt. where I C is the LDR sink current capability, CIN is the equiva- lent capacitance seen at the LDR pin, and V C is the gate-to- source voltage of the MOSFET. I C is limited by the low-side driver of the LM2655, but C IN is fixed by the MOSFET. Therefore, it is important that the chosen MOSFET has a suitable C IN so that the LM2655 will be able to turn it off within 30ns. An input capacitance of less than 1000pF is rec- ommended. Several suitable MOSFETs are shown in Table 1. EXTERNAL SCHOTTKY DIODE (Syncronous) A Schottky diode is recommended to prevent the intrinsic body diode of the low-side MOSFET from conducting during the deadtime in PWM operation. If the body diode turns on, there is extra power dissipation in the body diode because of the reverse-recovery current and higher forward voltage drop. In addition, the high-side MOSFET has more switching loss because the diode reverse-recovery current adds to the high-side MOSFET turn-on current. These losses degrade the efficiency by 1-2%. The improved efficiency and noise immunity with the Schottky diode become more obvious with increasing input voltage and load current. It is important to place the diode very close to the switch pin of the LM2655. Extra parasitic impedance due to the trace between the switch pin and the cathode of the diode will cause the current limit to decrease. The breakdown voltage rating of the diode is preferred to be 25% higher than the maximum input voltage. Since it is on for a short period of time, the diode’s average current rating need only be 30% of the maximum output current. EXTERNAL SCHOTTKY DIODE (Asyncronous) In asyncronous mode, the output current commutates throught the schottky diode when the high-side MOSFET is turned off. Using a schottky diode with low forward voltage drop will minimize the effeciency loss in the diode. However, to achieve the greatest efficiency, the LM2655 should be op- erated in syncronous mode using a low-side MOSFET. Since the Schottky diode conducts for the entire second half of the duty cycle in asyncronous mode, it should be rated higher than the full load current. BOOST CAPACITOR The boost capacitor provides the extra votage needed to turn the high-side, n-channel MOSFET on. A 0.1 µF ceramic capacitor is recommended for the boost capacitor. The typi- cal voltage across the boost capacitor is 6.7V. DS101284-21 FIGURE 1. Low-side/high-side driver timing diagram. www.national.com 10 |
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