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MIC864YMX Datasheet(PDF) 2 Page - Micrel Semiconductor |
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MIC864YMX Datasheet(HTML) 2 Page - Micrel Semiconductor |
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2 / 11 page ![]() Micrel, Inc. MIC864 Ordering Information Part Number Marking Junction Temperature Range Package MIC864YM 864YM –40 °C to +125°C 8-Pin SOIC MIC864YMX 864 –40 °C to +125°C 10-Pin Extra Thin DFN (2.5mm x 2.5mm x 0.4mm) (1) Note: 1. Extra Thin DFN package pin 1 identifier = ▼. Pin Configuration 5 6 7 8 9 10 NC NC 8-Pin SOIC (M) (Top View) 10-Pin 2.5mm x 2.5mm XTDFN (MX) (Top View) Pin Description Pin Number SOIC Pin Number XTDFN Pin Name Pin Function 1 1 OUTA Output of operational amplifier A. 2 2 −INA Inverting input of operational amplifier A. 3 3 +INA Non-inverting input of operational amplifier A. 4 4 V − Negative Power Supply Connection. Connect to GND for single supply operation. 5 7 +INB Non-inverting input of operational amplifier B. 6 8 −INB Inverting input of operational amplifier B. 7 9 OUTB Output of operational amplifier B. 8 10 V+ Positive Power Supply Input. Connect a 0.1µF ceramic bypass capacitor from V+ to V −, placed within 0.2in (5mm) of the MIC864. - 5, 6 NC Not internally connected, leave unconnected. - EP ePad Heatsink pad, connect to GND for best thermal performance. June, 2014 2 063014-2.0 |
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