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LAN89730 Datasheet(PDF) 193 Page - Microchip Technology

Part # LAN89730
Description  Implements Reduced Power Operating Modes
PDF  218 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN89730 Datasheet(HTML) 193 Page - Microchip Technology

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 2013-2015 Microchip Technology Inc.
DS60001348A-page 193
LAN89730
7.0
OPERATIONAL CHARACTERISTICS
7.1
Absolute Maximum Ratings*
+3.3 V Supply Voltage (VDD33IO, VDD33A) Note 7-1.................................................................................... 0 V to +3.6 V
+1.2 V Supply Voltage (VDD12CORE, VDD12PLL, VDD12USBPLL, VDD12A) Note 7-1.................................. 0 V to +1.32 V
Positive voltage on input signal pins, with respect to ground Note 7-2 ................................................. VDD33IO + 0.3 V
Negative voltage on input signal pins, with respect to ground Note 7-3 ..................................................................-0.3 V
Positive voltage on XI, with respect to ground ........................................................................................................1.26 V
Storage Temperature ..............................................................................................................................-55oC to +150oC
Maximum Junction Temperature Under Bias ....................................................................................................... .+125oC
Note 7-1
Supply voltage ratings are for externally supplied voltages. When powering this device from laboratory
or system power supplies, it is important that the absolute maximum ratings not be exceeded or device
failure can result. Some power supplies exhibit voltage spikes on their outputs when AC power is
switched on or off. In addition, voltage transients on the AC power line may appear on the DC output.
If this possibility exists, it is suggested to use a clamp circuit.
Note 7-2
This rating does not apply to the following pins: XI, XO, EXRES, USBRBIAS, HSIC_STROBE,
HSIC_DATA.
Note 7-3
This rating does not apply to the following pins: EXRES, USBRBIAS, HSIC_STROBE, HSIC_DATA.
* Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating
only. Functional operation of the device at any condition exceeding those indicated in Section 7.2, "Operating Condi-
tions**", Section 7.5, "DC Specifications", or any other applicable section of this specification is not implied. Note, device
signals are NOT 5 Volt tolerant unless specified otherwise.
7.2
Operating Conditions**
+3.3 V Supply Voltage (VDD33IO, VDD33A) .................................................................................................. +3.3 V +/-5%
+1.2 V Supply Voltage (VDD12CORE, VDD12PLL, VDD12USBPLL, VDD12A) .................................................. +1.2 V +/-5%
Ambient Operating Temperature in Still Air (TA)***................................................................................... -40oC to +85oC
** Supply voltage ratings are for externally supplied voltages. Proper operation of the device is guaranteed only within
the ranges specified in this section.
*** Junction temperature must not exceed +125°C.
7.3
Package Thermal Specifications
TABLE 7-1:
PACKAGE THERMAL PARAMETERS
Parameter
Symbol
Value
Unit
Comments
Thermal resistance
ΘJA
31.0
oC/W
Measured in still air from the die to ambient air
Junction-to-Top-of-Package
ΨJT
0.3
oC/W
Measured in still air
Note:
Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.



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