MCP632 datasheet(57/60 Pages) MICROCHIP

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 2009-2014 Microchip Technology Inc.

DS20002197C-page 57

MCP631/2/3/4/5/9

APPENDIX A: REVISION HISTORY

Revision C (July 2014)

The following is the list of modifications:

Updated the Features: list.

Added the High Gain-Bandwidth Op Amp

Portfolio table in the Features: section.

Updated Figures 4-6 and 4-11.

Updated

Section 6.0

“Packaging

Information”

and

Section 6.1

“Package

Marking Information”.

Minor typographical changes.

Revision B (November 2011)

The following is the list of modifications:

Added the MCP634 and MCP639 amplifiers to

the product family and the related information

throughout the document.

Added the 2x3 TDFN (8L), SOT23 (5L) package

option for MCP631, SOT23 (6L) package option

for MCP633, 4x4 QFN (16L) package option for

MCP639, SOIC and TSSOP (14L) package

options for MCP634 and the related information

throughout the document. Updated package

types drawing with pin designation for each new

package.

Updated the Temperature Specifications table to

show the temperature specifications for new

packages.

Updated Table 3-1 to show all the pin functions.

Updated Section 6.0 “Packaging Informa-

tion” with markings for the new additions.

Added the corresponding SOT23 (5L), SOT23

(6L), TDFN (8L), SOIC, TSSOP (14L), and 4x4

QFN (16L) package options and related infor-

mation.

Updated table description and examples in the

Product Identification System section.

Revision A (August 2009)

• Original Release of this Document.

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