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MGC3030 Datasheet(PDF) 17 Page - Microchip Technology |
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MGC3030 Datasheet(HTML) 17 Page - Microchip Technology |
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17 / 50 page  2012-2015 Microchip Technology Inc. Advance Information DS40001667D-page 17 MGC3030/3130 4.0 FUNCTIONAL DESCRIPTION Microchip Technology’s MGC3X30 configurable controller uses up to five E-field receiving electrodes. Featuring a Signal Processing Unit (SPU), a wide range of 3D gesture applications are being pre- processed on the MGC3X30, which allows short development cycles, as no host processing is needed. Always-on 3D sensing, even for battery-driven mobile devices, is enabled due to the chip’s low-power design and variety of programmable power modes. A Self Wake-up mode triggers interrupts to the application host reacting to interaction of a user with the device and supporting the host system in overall power reduction. The MGC3X30 offers one enhanced I2C™ interface in including SDA, SCL and TS line (EIO0) for data exchange with a host controller. GestIC® sensing electrodes are driven by a low-volt- age signal with a frequency in the range of 100 kHz, which allows their electrical conductive structure to be made of any low-cost material. Even the reuse of exist- ing conductive structures, such as a display’s ITO coat- ing, is feasible, making the MGC3X30 an overall, very cost-effective system solution. Figure 4-1 provides an overview of the main building blocks of MGC3X30. These blocks will be described in the following sections. FIGURE 4-1: MGC3X30 CONTROLLER BLOCK DIAGRAM Host Signal processing unit (SPU) Power management unit (PMU) Internal clock TX signal generation External electrodes Communication control (I2C) MGC3030/ 3130 Controller Signal conditioning ADC Signal conditioning ADC Signal conditioning ADC Signal conditioning ADC Signal conditioning ADC FLASH memory Gesture Port and Interface Selection Reset block Voltage reference (VREF) TXD RX0 RX1 RX2 RX3 RX4 MCLR SI0 SI1 EIO1/IS1 EIO2 EIO3 IS2 EIO0 Low power wake-up Host Signal processing unit (SPU) Power management unit ((PMU)) Internal clock TX signal generation External electrodes Communication control (I2C) MGC3030/ 3130 Controller Signal conditioning ADC Signal conditioning ADC Signal conditioning ADC Signal conditioning ADC Signal conditioning ADC FLASH memory y Gesture Port and Interface Selection Reset block Voltage reference ((VREF)) TXD RX0 RX1 RX2 RX3 RX4 MCLR SI0 SI1 EIO1/IS1 EIO2 EIO3 IS2 EIO0 Low power wake-up p EIO6 EIO7 |
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