NEB-D datasheet(32/36 Pages) CUI

32 / 36 page

cui.com

date 06/10/2016

│ page 32 of 36

CUI Inc

│ SERIES: NEB-D │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS

Soldering Information - Surface Mounting

The surface mount product is intended for forced

convection or vapor phase reflow soldering in SnPb and

Pb-free processes.

The reflow profile should be optimised to avoid excessive

heating of the product. It is recommended to have

a sufficiently extended preheat time to ensure an

even temperature across the host PWB and it is also

recommended to minimize the time in reflow.

A no-clean flux is recommended to avoid entrapment of

cleaning fluids in cavities inside the product or between

the product and the host board, since cleaning residues

may affect long time reliability and isolation voltage.

Average ramp-up (TPRODUCT)3°C/s max3°C/s max

Typical solder melting (liquidus)

temperature

T183°C

221°C

Minimum reflow time above TL

60 s60 s

Minimum pin temperatureT

210°C

235°C

Peak product temperatureT

225°C

PRODUCT

260°C

Average ramp-down (TPRODUCT)6°C/s max6°C/s max

Maximum time 25°C to peak

6 minutes

8 minutes

TPRODUCT maximum

TPIN minimum

Time

profile

Product

profile

Time in

reflow

Time in preheat

/ soak zone

Time 25°C to peak

Temperature

General reflow process specifications SnPb eutectic Pb-free

Minimum Pin Temperature Recommendations

Pin number 5 chosen as reference location for the

minimum pin temperature recommendation since this will

likely be the coolest solder joint during the reflow process.

SnPb solder processes

For SnPb solder processes, a pin temperature (T

PIN) in

excess of the solder melting temperature, (T

L, 183°C

for Sn63Pb37) for more than 60 seconds and a peak

temperature of 220°C is recommended to ensure a reliable

solder joint.

For dry packed products only: depending on the type of

solder paste and flux system used on the host board, up to

a recommended maximum temperature of 245°C could be

used, if the products are kept in a controlled environment

(dry pack handling and storage) prior to assembly.

Lead-free (Pb-free) solder processes

For Pb-free solder processes, a pin temperature (T

PIN)

in excess of the solder melting temperature (T

L, 217 to

221°C for SnAgCu solder alloys) for more than 60 seconds

and a peak temperature of 245°C on all solder joints is

recommended to ensure a reliable solder joint.

SnPb solder processes

For SnPb solder processes, the product is qualified for MSL

1 according to IPC/JEDEC standard J STD 020C.

During reflow T

PRODUCT must not exceed 225 °C at any time.

Top of the product PWB near pin 2 is chosen as reference

location for the maximum (peak) allowed product

temperature (T

PRODUCT) since this will likely be the warmest

part of the product during the reflow process.

Maximum Product Temperature Requirements

Pb-free solder processes

For Pb-free solder processes, the product is qualified for

MSL 3 according to IPC/JEDEC standard J-STD-020C.

During reflow T

PRODUCT must not exceed 260 °C at any time.

Dry Pack Information

Products intended for Pb-free reflow soldering processes

are delivered in standard moisture barrier bags according

to IPC/JEDEC standard J STD 033 (Handling, packing,

shipping and use of moisture/reflow sensitivity surface

mount devices).

Using products in high temperature Pb-free soldering

processes requires dry pack storage and handling. In

case the products have been stored in an uncontrolled

environment and no longer can be considered dry, the

modules must be baked according to J STD 033.

Thermocoupler Attachment

Top of PWB near pin 2 for measurement of maximum

product temperature, TPRODUCT

Pin 5 for measurement of minimum pin (solder joint)

temperature, T

For more information, please visit the product page.

NEB-D Datasheet(PDF) 32 Page - CUI INC

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