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LM4842 Datasheet(PDF) 9 Page - National Semiconductor (TI) |
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LM4842 Datasheet(HTML) 9 Page - National Semiconductor (TI) |
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9 / 31 page ![]() Typical Performance Characteristics MH/LQ Specific Characteristics (Continued) LM4842MH/LQ Power Dissipation vs Output Power LM4842MH/LQ (Note 17) Power Derating Curve 20028165 20028164 Note 17: These curves show the thermal dissipation ability of the LM4842MH/LQ at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. Non-MH/LQ Specific Characteristics THD+N vs Frequency THD+N vs Frequency 20028157 20028158 www.national.com 9 |
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