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EXAMPLE BOARD LAYOUT

(3.2)

FULL R

TYP

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

30X (0.2)

30X (0.5)

(

) TYP

VIA

0.2

26X (0.4)

(4.4)

(2.4)

(1.2)

TYP

(1.2)

(0.7) TYP

(R

) TYP

0.05

4X (0.2)

WQFN - 0.8 mm max height

RNH0030A

PLASTIC QUAD FLATPACK - NO LEAD

4221819/A 04/2015

SYMM

1

10

11

15

16

25

26

30

SYMM

LAND PATTERN EXAMPLE

SCALE:18X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)