AD9364BBCZ datasheet(11/33 Pages) AD

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AD9364

Data Sheet

Rev. C | Page 10 of 32

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

Rating

VDDx to VSSx

−0.3 V to +1.4 V

VDD_INTERFACE to VSSx

−0.3 V to +3.0 V

VDD_GPO to VSSx

−0.3 V to +3.9 V

Logic Inputs and Outputs to

VSSx

−0.3 V to VDD_INTERFACE + 0.3 V

Input Current to Any Pin

Except Supplies

±10 mA

RF Inputs (Peak Power)

2.5 dBm

Tx Monitor Input Power (Peak

Power)

9 dBm

Package Power Dissipation

(TJMAX − TA)/θJA

Maximum Junction

Temperature (TJMAX)

110°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

REFLOW PROFILE

The AD9364 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 12. Thermal Resistance

Package

Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4



1, 2

Unit

144-Ball

CSP_BGA

32.3

9.6

20.2

0.27

°C/W

1.0

29.6

0.43

°C/W

2.5

27.8

0.57

°C/W

1 Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-STD 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

ESD CAUTION

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