2

s ABSOLUTE MAXIMAM RATINGS

(Ta = 25

°C)

s ELECTRICAL CHARACTERISTICS

°C)

s RECOMMENDED OPERATING CONDITIONS

(Ta = -40 to 85

°C)

Rating

Symbol

Value

Unit

Input voltage

-10.0 to 0.5

V

Output voltage

Min. -20.0

V

Power dissipation

300 (DIP-8pin) / 150 (SOP4-8pin)

mW

Operating temperature

-40 to 85

°C

Storage temperature

-65 to 150

°C

Soldering temperature and time

260

°C, 10s (at lead)

–

Note: When this IC is soldered in the solder-reflow process, be sure to maintain the reflow furnace at the curve shown in “Fig.

3-5 Temperature Profile for Standard SMD Package (QFP, SOP, PLCC and etc.) of this DATA BOOK. And this IC can

not be exposed to high temperature of the solder dipping.

Characteristic

Symbol

Condition

Min.

Typ.

Max.

Unit

Input voltage

-8.0

–

-1.5

V

Output voltage

-16.0

––

V

Booster current consumption

–

20

30

µA

Stationary current

––

2.0

µA

Output impedamce

–

75

100

Ω

Booster power conversion efficiency

90

95

–

%

Input leakage current

––

2.0

µA

Oscillation frequency

16

20

24

kHz

Condition

Symbol

Remark

Min.

Typ.

Max.

Unit

––

-1.5

V

Booster start voltage

≥ 10µF Ta = -20 to 85°C

Ω

––

-2.2

V

Booster stop voltage

Ω

-1.5

––

V

Output load resistance

––

Ω

Output current

––

30

mA

Oscillation frequency

10

–

30

kHz

External resistance for oscillation

680

–

2000

k

Ω

Capacitor for booster

3.3

––

µF

Notes: *1: Recommended circuity in low voltage operation is shown below.