M52340SP datasheet(25/44 Pages) MITSUBISHI

25 / 44 page

PAL/NTSC SYSTEM SHINGLE-CHIP COLOR TV SIGNAL PROCESSOR

M52340SP

MITSUBISHI ICs (TV)

OFRG Offset voltage between R and G

OFBG Offset voltage between B and G

1. Measure DC voltage of output at pins 21,22 and 23

except that at blanking part.

2. OFRG and OFBG are defines as follows:

OFRG =

(pin 21 Measured voltege)-(pin 22. Measured voltege) (mV)

OFBG =

(pin 23 Measured voltege)-(pin 22 Measured voltege) (mV)

R(C) R cutoff characteristics

G(C) G cutoff characteristics

B(C) B cutoff characteristics

1. Measure DC voltage of output at pins 21,22 and 23 when

R(C), G(C) and B(C) data are maximum and minimum

respectively. The DC voltage at blanking part should be

measured.

2. R(C), G(C) and B(C) are defined as follows:

R(C), G(C), and B(C) =

(Voltage at data max.) - (Voltage at data min.) (V)

DLF DL fine delay

1. Input SGA to VI IN.

2. Measure the time lag (absolute value) between signal

YDL4 and output signal at pins 21,22 and 23.

Y14

YDL4 signal

Output signal

Measure the time lag at the center point of rise.

Ccon1 Color control characteristics 1

1. Input SGE to -R IN (pin 45).

2. Measure output amplitude at pins 21,22 and 23 under

each condition.

Ccon2 Color control characteristics 2

1. Input SGF to VI IN.

2. Measure output amplitude of the element of 4.43MHz

when the mute switch is on and off. (VMFon, VMFoff)

3. VMF is defined as follows:

VMF = 20 log

VMF Video mute characteristics

TRFon (VP-P)

TRFoff (VP-P)

(dB)

1. Input SGE to -B IN (pin 44).

2. Measure output amplitude at pins 22 and 23.

(P23 = MTXB, P22 = MTXG)

MTXB Matrix characteristics 1

MTXG Matrix characteristics 2

1. Input SGE to -R IN (pin 45).

2. Measure output amplitude at pins 21 and 22.

(P21 = MTXR, P22 = MTXG1)

MTXR Matrix characteristics 3

MTXG1 Matrix characteristics 4

1. Input SGD to FB, ER, EG and EB.

2. Measure rise time and fall time of the signal of output at

pins 21,22 and 23. Measurement points should be higher

than the pedestal level and blanking part should not be

measured.

OSD1 OSD speed characteristics 1

OSD2 OSD speed characteristics 2

OSD1

OSD2

10%

90%

Output waveform at

pins 21,22 and 23.

1. Input SGA to VI IN.

2. Measure output amplitude at pins 21,22 and 23 when

2.9V and 0V are externally applied to pin 26.

GYmax1 Contrast control characteristics 3

GYmin1 Contrast control characteristics 4

Make current flow out from pin 40 and measure the flow

current when the burst gate pulse is not found at pin 12.

ISS Sync separation input sensitivity current

BGP2 BGP timing 2

BGPW BGP pulse width

BGP1 BGP timing 1

BGP1,BGP2

BGPW

P40 SYNC

P12 SCP

Measure the output frequency at pin 13 when no signal is

input.

FH Horizontal free run frequency

FPH1 Horizontal pull-in range 1

FPH2 Horizontal pull-in range 2

Change the frequency of SGc and measure the frequency at

the moment when the output signal at pin 13 and the input

signal at pin 40 are pulled in. The horizontal pull-in range is

measured by comparing with the horizontal free run

frequency.

HPT2 Horizontal pulse timing 2

HPT3 Horizontal pulse timing 3

HPT1 Horizontal pulse timing 1

HPT1, HPT2, HPT3

P40 SYNC

P13 H OUT

M52340SP Datasheet(PDF) 25 Page - Mitsubishi Electric Semiconductor

M52340SP Datasheet(HTML) 25 Page - Mitsubishi Electric Semiconductor

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