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STM8S003F3 Datasheet(PDF) 97 Page - STMicroelectronics

Part # STM8S003F3
Description  Extended instruction set
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
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STM8S003F3 Datasheet(HTML) 97 Page - STMicroelectronics

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STM8S003F3 STM8S003K3
Package information
98
10.4
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 19: General operating conditions.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated
using the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
TAmax is the maximum ambient temperature in ° C
•ΘJA is the package junction-to-ambient thermal resistance in ° C/W
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/Omax represents the maximum power dissipation on output pins, where:
PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), and taking account of the actual VOL/IOL and
VOH/IOH of the I/Os at low and high level in the application.
10.4.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Table 55. Thermal characteristics(1)
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
60
°C/W
Thermal resistance junction-ambient
TSSOP20 - 4.4 mm
84
Thermal resistance junction-ambient
UFQFPN20 -3 x 3 mm
90


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