Package information

ESDA18-1F4

6/8

Doc ID 023828 Rev 1

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 13.

Package dimensions

Note:

Product marking may be rotated by 90° for assembly plant differentiation. In no case should

this product marking be used to orient the component for its placement on a PCB. Only pin

1 mark is to be used for this purpose.

Figure 14.

Foot print recommendations

Figure 15.

Marking

172 µm

645 µm ± 30 µm

175 µm ± 20 µm

120µm

300 µm ± 30

605 µm ± 55

Copper pad diameter:

220 µm recommended

260 µm maximum

Solder stencil opening:

220 µm recommended

Solder mask opening:

300 µm minimum

y

E

Dot,

xx = marking