Package information

ESDAVLC6-1V2

4/8

DocID025241 Rev 1

2

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 6. Package dimensions

Figure 7. Footprint recommendation

50 µm

50 µm

50 µm

75 µm

75 µm

200 µm

25 µm ± 10

450 µm ± 20

Solder pad

PCB opening

A = 225 µm

B = 225 µm

C = 50 µm

D = 180 µm

E = 180 µm

F = 100 µm

G = 530 µm

H = 40 µm

I = 112.5 µm

J = 270 µm

A

B

C

D

E

F

G

H

I

J