DocID025241 Rev 1

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ESDAVLC6-1V2

Recommendation on PCB assembly

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Recommendation on PCB assembly

3.1

Stencil opening design

Stencil opening thickness: 80 µm

Figure 8. Recommended stencil window position

3.2

Solder paste

1.

Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste recommended.

3.

Offers a high tack force to resist component displacement during PCB movement.

4.

Solder paste with fine particles: type 4 (powder particle size 20-38 µm per IPC J-STD-

005).

K = 180 µm

L = 180 µm

M = 150 µm

Solder pad

PCB opening

Stencil aperture (thickness stencil: 80 µm)

K

L

M

N

N = 30 µm