ESD8024

http://onsemi.com

4

TYPICAL CHARACTERISTICS

Figure 8. RF Insertion Loss

FREQUENCY (Hz)

9E9

1E9

1E8

1E7

1E6

−20

−18

−14

−12

−10

−6

−4

0

−16

−8

−2

Figure 9. Capacitance over Frequency

FREQUENCY (GHz)

3.00

2.55

2.05

1.55

1.05

0.55

0.05

0

0.5

1.0

1.5

2.0

3.0

3.5

4.0

2.5

PCB Layout Guidelines

Steps must be taken for proper placement and signal trace

routing of the protection device in order to ensure the

maximum survivability and signal integrity for the

application. Such steps are listed below.

I/O connector to reduce the transient path to ground and

improve the protection performance.

far as possible from the protection device to help

further improve protection performance.

data lines as short as possible. These “stub” traces, if

long enough, can create voltage drops that impede the

turn-on of the protection device.

impedance matching of all high speed signal traces.

reflections.

and negative lines of the differential data lanes to

avoid common mode noise generation and

impedance mismatch.