4

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)

Thermal Profile (Option #300)

Regulatory Information

The HSSR-8060 has been

approved by the following

organizations:

UL

Recognized under UL 508,

Component Recognition Program,

Industrial Control Switches, File

E142465.

CSA

Approved under CAN/CSA-C22.2

No. 14-95, Industrial Control

Equipment, File LR 87683.

Figure 1. Maximum Solder Reflow Thermal Profile.

(Note: Use of non-chlorine activated fluxes is recommended.)

4.19

(0.165)

2.29

(0.090)

2.54

(0.100)

TYP.

0.635 ± 0.130

(0.025 ± 0.005)

9.65 ± 0.25

(0.380 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

0.635 ± 0.25

(0.025 ± 0.010)

12° NOM.

0.20 (0.008)

0.30 (0.013)

1.78

(0.070)

MAX.

9.65 ± 0.25

(0.380 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

DIMENSIONS IN mm (INCHES)

TOLERANCES: xx.xx = 0.01

xx.xxx = 0.001

(unless otherwise specified)

LEAD COPLANARITY

MAXIMUM: 0.102 (0.004)

[3] [5]

1.194 (0.047)

1.778 (0.070)

4.826

(0.190)

TYP.

9.398 (0.370)

9.906 (0.390)

MAX.

PAD LOCATION (FOR REFERENCE ONLY)

0.381 (0.015)

0.635 (0.025)

HP RXXXX

YYWW

TYPE NUMBER

DATE CODE