TMS320DM6431 datasheet(7/227 Pages) TI1

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Device Overview

2.1 Device Characteristics

TMS320DM6431

Digital Media Processor

www.ti.com

SPRS342C – NOVEMBER 2006 – REVISED JUNE 2008

Table 2-1, provides an overview of the TMS320DM6431 DSP. The tables show significant features of the

DM6431 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the

package type with pin count.

Table 2-1. Characteristics of the DM6431 Processor

HARDWARE FEATURES

DM6431

DDR2 Memory Controller

(16-bit bus width) [1.8 V I/O]

Asynchronous (8-bit bus width),

Asynchronous EMIF [EMIFA]

RAM, Flash, (8-bit NOR or 8-bit NAND)

EDMA3

1 (64 independent channels, 8 QDMA channels)

2 64-bit General Purpose

Timers

(configurable as 2 64-bit or 4 32-bit)

1 64-bit Watch Dog

Peripherals

UART

1 (with RTS and CTS flow control)

Not all peripherals pins

I2C

1 (Master/Slave)

are available at the same

time (For more detail, see

McBSP

the Device Configuration

McASP

1 (4 serailizers)

section).

10/100 Ethernet MAC (EMAC) with

Management Data Input/Output (MDIO)

General-Purpose Input/Output Port (GPIO)

Up to 111 pins

PWM

3 outputs

Configurable Video Port

1 Input (VPFE)

HECC

Size (Bytes)

128KB RAM, 64KB ROM

32K-Byte (32KB) L1 Program (L1P) RAM/Cache

(Cache up to 32KB)

On-Chip Memory

Organization

64KB L1 Data (L1D) RAM/Cache

64KB Unified Mapped RAM/Cache (L2)

64KB Boot ROM

Revision ID Register (MM_REVID.[15:0])

See the TMS320DM6437/35/33/31 Digital Media

MegaModule Rev ID

(address location: 0x0181 2000)

Processor (DMP) [Silicon Revisions 1.1 and 1.0]

Silicon Errata (literature number SPRZ250).

CPU ID + CPU Rev ID

Control Status Register (CSR.[31:16])

JTAGID register

See Section 6.21.1, JTAG ID (JTAGID) Register

JTAG BSDL_ID

(address location: 0x01C4 0028)

Description(s)

CPU Frequency

MHz

300

Cycle Time

3.33 ns (-3/-3Q/-3S)

Core (V)

1.2 V (-3/-3Q/-3S)

Voltage

I/O (V)

1.8 V, 3.3 V

MXI/CLKIN frequency multiplier

PLL Options

x1 (Bypass), x14 to x30

(27 MHz reference)

16 x 16 mm, 0.8 mm pitch

361-Pin BGA (ZWT)

BGA Package(s)

23 x 23 mm, 1.0 mm pitch

376-Pin BGA (ZDU)

Process Technology

µm

0.09

µm

Product Preview (PP), Advance Information (AI),

Product Status(1)

or Production Data (PD)

(1)

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

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Device Overview

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