MAX1921 datasheet(3/8 Pages) MAXIM

3 / 8 page

II. Manufacturing Information

A. Description/Function:

Low-Voltage, 400mA Step-Down DC-DC Converters in SOT23

B. Process:

C. Number of Device Transistors:

1467

D. Fabrication Location:

California, USA

E. Assembly Location:

Philippines, Malaysia or Thailand

F. Date of Initial Production:

January, 2002

III. Packaging Information

A. Package Type:

6-Lead SOT23

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Non-Conductive Epoxy

E. Bondwire:

Gold (1.3 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

# 05-3501-0021

H. Flammability Rating:

Class UL94-V0

Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112:

Level 1

IV. Die Information

A. Dimensions:

60 x 41 mils

B. Passivation:

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

C. Interconnect:

Aluminum/Copper/Silicon

D. Backside Metallization:

None

E. Minimum Metal Width:

.8 microns (as drawn)

F. Minimum Metal Spacing:

.8 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO2

I. Die Separation Method:

Wafer Saw

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