DAC38RF82IAAV datasheet(39/140 Pages) TI1

39 / 140 page

DAC38RF82, DAC38RF89

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SLASEA6B – FEBRUARY 2017 – REVISED AUGUST 2017

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program that particular DAC chip to use phase tolerance window “00”. This mapping is indicated in the figure

with the label “θ1|θ12|θ2: window=00”. Having programmed the device to use window “00”, all future SYSREF

events that occur in θ1 or θ2 would trigger the LMFC and frame clock to be aligned using the following rising

clock edge as the alignment reference (as indicated by the red arrow pointing to rising clock edge “R” and

labeled “Window=00/01 alignment edge”).

The full extent of each phase tolerance window is indicated in the figure using “box and whisker” plots. For the

“window=00” example, the “box” portion of the plot indicates that the phase tolerance window is centered on θ12

(to be precise on the boundary between θ1 and θ2) and the “whisker” portion indicates that even if the rising

edge of SYSREF occurs as early as the preceding θ4 or as late as the following θ3 it still results in LMFC and

frame clock alignment to the same rising clock edge indicated by the red arrow labeled “Window=00/01

alignment edge”. When programmed for phase tolerance window “00”, the DAC chip is tolerant to variations in

the SYSREF timing ranging from a rising SYSREF edge that occurs just after one rising edge of clock to just

before the next rising edge of the clock. The qualifying phrases “just after” and “just before” are used here to

indicate that the SYSREF transition must occur far enough away from the rising edges of the clock to avoid

setup/hold violations and prevent the device from concluding that the SYSREF transition has crossed out off the

phase tolerance window when in fact it has not. The tolerance range for window “00” is from rising clock edge to

rising clock edge and is indicated in the figure by the green text labeled “tolerance = R

↔R”.

Following the above example, if characterization reveals SYSREF timing centered on θ23 then phase tolerance

window “01” (with tolerance for SYSREF rising edge events from EF to EF) should be chosen. Notice that this

option is tolerant even to rising SYSREF edges that occur after the rising device clock edge (i.e. in θ4) and will

treat them just as if they had occurred in one of the earlier three phases, aligning to the same rising device clock

edge indicated by the red arrow labeled “Window=00/01 Alignment Edge”. This allows the system designer to

tolerate PCB design errors and/or environmental and manufacturing variations – achieving his intended

alignment without having to make physical changes to the board to adjust the SYSREF timing.

Similarly, if characterization indicates that SYSREF timing is centered on θ34 or θ41 then phase tolerance

window “10” or “11” can be selected, resulting in tolerance for “F

↔F” or “ER↔ER” SYSREF timing, respectively.

Note, however, that in these two cases the alignment reference edge is by default taken to be the subsequent

rising edge of the device clock. Since this may not be the desired behavior, the DAC38RF82 (or DAC38RF89)

allows the user to program in an optional alignment offset of θ1 if the default offset of 0 does not achieve the

desired alignment. This feature is illustrated in Figure 32 where the user can see that by setting the alignment

offset to -1, phase tolerance windows “10” and “11” can be made to trigger alignment to the earlier rising device

clock edge used by windows “00” and “01”. Alternatively, the window “00” and “01” alignment edge can be

pushed one cycle later by setting their alignment offset to +1.

Figure 32. Optional SYSREF Alignment Offset

DAC38RF82IAAV Datasheet(PDF) 39 Page - Texas Instruments