15

LTC3413

sn3413 3413fs

PACKAGE DESCRIPTIO

FE Package

16-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663,

Exposed Pad Variation BA)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

FE16 (BA) TSSOP 0203

0.09 – 0.20

(.0036 – .0079)

0

° – 8°

0.45 – 0.75

(.018 – .030)

4.30 – 4.50*

(.169 – .177)

6.40

BSC

13

4

5

6 7 8

10

9

4.90 – 5.10*

(.193 – .201)

16 1514 13 12 11

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

2.74

(.108)

2.74

(.108)

0.195 – 0.30

(.0077 – .0118)

2

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

RECOMMENDED SOLDER PAD LAYOUT

3. DRAWING NOT TO SCALE

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

2.74

(.108)

2.74

(.108)

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT