4

TMP235, TMP236

SBOS857 – SEPTEMBER 2017

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6 Specifications

6.1 Absolute Maximum Ratings

MIN

MAX

UNIT

Voltage

+6

V

–0.3

Current

Output

–30

+30

mA

Latch-Up Current, Each Pin

–200

+200

Temperature

+150

°C

–65

+150

(1)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM) per JESD22-A114

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

(1)

±1000

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Input Voltage (TMP235)

2.3

5.5

V

Input Voltage (TMP236)

3.1

5.5

Operating free-air temperature

–50

150

°C

(1)

For information on self-heating and thermal response time see Layout Guidelines section.

(2)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

(3)

The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K

board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are

included in the PCB, per JESD 51-5.

(4)

Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

6.4 Thermal Information

TMP235

UNIT

DCK (SC70)

DBZ (SOT-23)

PINS

PINS

275

167

°C/W

Junction-to-case (top) thermal resistance

84

90

°C/W

Junction-to-board thermal resistance

56

146

°C/W

Junction-to-top characterization parameter

1.2

35

°C/W

Junction-to-board characterization parameter

55

146

°C/W