TPS40020

TPS40021

SLUS535C − MARCH 2003 − REVISED SEPTEMBER 2004

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3

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

TA

LOAD CURRENT(1)

PACKAGE

PART NUMBER

−40

°C to 85°C

SOURCE

Plastic HTSSOP (PWP)(2)

TPS40020PWP

−40

°C to 85°C

SOURCE/SINK

Plastic HTSSOP (PWP)(2)

TPS40021PWP

(1) See page 7 for explanation.

(2) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS40020PWPR). See the application section of

the data sheet for PowerPAD drawing and layout information.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(4)

TPS4002X

UNIT

SS/SD, VDD, PVDD, OSNS

−0.3 to 6

BOOT2, BOOT1

VSW + 6

Input voltage range, VIN

SW

−3.0 to 10.5

V

Input voltage range, VIN

SWT (SW transient < 50 ns)

−5

V

FB, ILIM

−0.3 to 6.0

Output voltage range, VOUT

COMP, PWRGD, RT

−0.3 to 6

Sink current, IS

PWRGD

10

mA

Operating virtual junction temperature range, TJ

−40 to 125

Storage temperature, Tstg

−55 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

C

(4) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Input voltage, VIN

2.25

5.5

V

Operating junction temperature, TJ

−40

85

°C

THERMAL

PAD

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

ILIM/SYNC

VDD

OSNS

FB

COMP

SS/SD

RT

SGND

BOOT1

HDRV

SW

BOOT2

PVDD

LDRV

PGND

PWRGD

PWP PACKAGE(5)(6)

(TOP VIEW)

(5) For more information on the PWP package, refer to TI Technical Brief, Literature No. SLMA002.

(6) PowerPAD

t heat slug must be connected to SGND (Pin 8), or electrically isolated from all other pins.