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FSA4476 Datasheet(PDF) 14 Page - ON Semiconductor |
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FSA4476 Datasheet(HTML) 14 Page - ON Semiconductor |
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14 / 15 page ![]() © © 2016 Semiconductor Components Industries, LLC www.onsemi.com FSA4476 • Rev. 1.3.2 13 Physical Dimensions Figure 15. 25-ball WLCSP RECOMMENDED MOUNTING FOOTPRINT (NSMD PAD TYPE) ASME Y14.5M, 2009. NOTES: 2. CONTROLLING DIMENSION: MILLIMETERS 1. DIMENSIONING AND TOLERANCING PER BOTTOM VIEW SIDE VIEW TOP VIEW A DIM MIN. NOM. MILLIMETERS MAX. 0.625 0.228 0.188 A1 0.208 2.030 A2 0.26 0.24 0.28 b D E 0.40 BSC e 0.586 0.547 2.000 2.060 3. DATUM C APPLIES TO THE SPHERICAL CROWN OF THE SOLDER BALLS DETAIL A A1 A2 0.396 0.360 0.378 BALL A1 INDEX AREA 2.030 0.03 C 2X 0.03 C E D B 2X A 1 2 3 4 5 A B C D E 25X 0.005 C A B Ø b e e SEATING PLANE 0.05 C D C A 2.000 2.060 4. DRAWING FILE NAME: UC025ADrevO A1 0.40 1.60 0.40 1.60 (Ø0.215)Bottom of Cu Pad (Ø0.315) Solder Mask Opening |
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