AD199x

Preliminary Technical Data

Rev. PrA – 1/20/05 | Page 14 of 16

OUTLINE DIMENSIONS

PIN 1

INDICATOR

TOP

VIEW

8.75

BSC SQ

9.00

BSC SQ

1

64

1

6

17

49

48

32

33

BOTTOM

VIEW

0.45

0.40

0.35

0.50 BSC

0.20 REF

12

0.80 MAX

0.65 TYP

1.00

0.85

0.80

7.50

REF

0.05 MAX

0.02 NOM

0.60 MAX

0.60 MAX

4.85

4.70

4.55

SQ*

SEATING

PLANE

0.30

0.25

0.18

*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD

EXCEPT FOR EXPOSED PAD DIMENSION

Figure 20. 64-Lead Frame Chip Scale Package (LFCSP)

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

Table 6. Ordering Guide

Products

Package

Temperature

Power

Rating

Package Description

Package Outline

AD1990ACPZ

AD1992ACPZ

AD1994ACPZ

AD1996ACPZ

–40°C to +85°C

–40°C to +85°C

–40°C to +85°C

–40°C to +85°C

5W per channel

10W per channel

25W per channel

40W per channel

Lead Frame Chip Scale Package

Lead Frame Chip Scale Package

Lead Frame Chip Scale Package

Power Small Outline Package

CP-64

CP-64

CP-64

PSOP-36