AD9277 datasheet(11/49 Pages) AD

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AD9277

Rev. 0 | Page 10 of 48

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

AVDD1 to GND

−0.3 V to +2.0 V

AVDD2 to GND

−0.3 V to +3.9 V

DRVDD to GND

−0.3 V to +2.0 V

GND to GND

−0.3 V to +0.3 V

AVDD2 to AVDD1

−2.0 V to +3.9 V

AVDD1 to DRVDD

−2.0 V to +2.0 V

AVDD2 to DRVDD

−2.0 V to +3.9 V

Digital Outputs (DOUTx+, DOUTx−,

DCO+, DCO−, FCO+, FCO−) to GND

−0.3 V to +2.0 V

CLK+, CLK−, SDIO to GND

−0.3 V to +2.0 V

LI-x, LO-x, LOSW-x to GND

−0.3 V to +3.9 V

CWI−, CWI+, CWQ−, CWQ+ to GND

−0.3 V to +3.9 V

PDWN, STBY, SCLK, CSB to GND

−0.3 V to +2.0 V

GAIN+, GAIN−, RESET, 4LO+, 4LO−,

GPO0, GPO1, GPO2, GPO3 to GND

−0.3 V to +3.9 V

RBIAS, VREF to GND

−0.3 V to +2.0 V

Operating Temperature Range (Ambient)

−40°C to +85°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL IMPEDANCE

Table 5.

Airflow Velocity (m/s)

θJA1

θJB

θJC

Unit

0.0

20.3

°C/W

1.0

14.4

7.6

4.7

°C/W

2.5

12.9

°C/W

1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad

soldered to PCB.

ESD CAUTION

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