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SLGC55545 Datasheet(PDF) 18 Page - Dialog Semiconductor |
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SLGC55545 Datasheet(HTML) 18 Page - Dialog Semiconductor |
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18 / 20 page ![]() 000-000C55545-101 Page 18 of 20 SLGC55545 Tape and Reel Specifications Carrier Tape Drawing and Dimensions Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 6.75 mm3 (nominal). More information can be found at www.jedec.org. Package Type # of Pins Nominal Package Size [mm] Max Units Reel & Hub Size [mm] Leader (min) Trailer (min) Tape Width [mm] Part Pitch [mm] per Reel per Box Pockets Length [mm] Pockets Length [mm] TQFN 16L 3X3mm Green 16 3 x 3 x 0.75 5,000 10,000 330 / 100 42 336 42 336 12 8 Package Type PocketBTM Length PocketBTM Width Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole to Tape Edge Index Hole to Pocket Center Tape Width A0 B0 K0 P0 P1 D0 E F W TQFN 16L 3X3mm Green 3.3 3.3 1.0 4.0 8.0 1.55 1.75 5.5 12.0 |
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