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PSMN004-36P Datasheet(PDF) 2 Page - NXP Semiconductors |
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PSMN004-36P Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 13 page ![]() Philips Semiconductors PSMN004-36P/36B N-channel enhancement mode field-effect transistor Product data Rev. 01 — 19 November 2001 2 of 13 9397 750 08621 © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 5. Quick reference data 6. Limiting values Table 2: Quick reference data Symbol Parameter Conditions Typ Max Unit VDS drain-source voltage (DC) Tj =25to175 °C − 36 V ID drain current (DC) Tmb =25 °C; VGS =5V − 75 A Ptot total power dissipation Tmb =25 °C − 230 W Tj junction temperature − 175 °C RDSon drain-source on-state resistance VGS = 10 V; ID = 25 A; Tj = 25°C 3.5 4 m Ω VGS =5V; ID = 25 A; Tj = 25°C 45m Ω Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage (DC) Tj =25to175 °C − 36 V VDGR drain-gate voltage (DC) Tj =25to175 °C; RGS =20kΩ− 36 V VGS gate-source voltage (DC) −±15 V VGSM gate-source voltage tp ≤ 50 µs; pulsed; duty cycle 25 %; Tj ≤ 150 °C −±20 V ID drain current (DC) Tmb =25 °C; VGS =5V; Figure 2 and 3 − 75 A Tmb = 100 °C; VGS =5V; Figure 2 − 75 A IDM peak drain current Tmb =25 °C; pulsed; tp ≤ 10 µs; Figure 3 − 240 A Ptot total power dissipation Tmb =25 °C; Figure 1 − 230 W Tstg storage temperature −55 +175 °C Tj operating junction temperature −55 +175 °C Source-drain diode IS source (diode forward) current (DC) Tmb =25 °C − 75 A ISM peak source (diode forward) current Tmb =25 °C; pulsed; tp ≤ 10 µs − 240 A Avalanche ruggedness EAS non-repetitive avalanche energy unclamped inductive load; ID =75A;tp = 0.1 ms; VDD =15V; RGS =50 Ω; VGS = 5V; starting Tj =25 °C; − 120 mJ IAS non-repetitive avalanche current unclamped inductive load; VDD =15V;RGS =50 Ω; VGS =5V; starting Tj =25 °C − 75 A |
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