4

TMP1075

SBOS854 – MARCH 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply, V+

6

V

Input voltage

–0.5

6

V

Input voltage

–0.5

(V+) + 0.5

V

Input current

10

mA

Operating temperature

–55

150

°C

150

°C

–60

130

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

2K

V

TBD

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.7

5.5

V

–55

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TMP1075

UNIT

DGK (SOIC),

D (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

202.5

°C/W

Junction-to-case (top) thermal resistance

82

°C/W

Junction-to-board thermal resistance

124.4

°C/W

Junction-to-top characterization parameter

17.9

°C/W

Junction-to-board characterization parameter

122.6

°C/W

Junction-to-case (bottom) thermal resistance

TBD

°C/W

Thermal Mass

TBD

TBD