DS64 LUXEON Rebel General Purpose Product Datasheet 20160427 ©2016 Lumileds Holding B.V. All rights reserved.

8

Table 7.

Profile Feature

Lead Free Assembly

Ramp-Up Rate (T

3°C / second max

Preheat Temperature Min (Ts

150°C

Preheat Temperature Max (Ts

200°C

Preheat Time (ts

60 - 180 seconds

Temperature (T

217°C

Time Maintained Above Temperature T

60 - 150 seconds

Peak / Classification Temperature (T

260°C

Time Within 5°C of Actual Peak Temperature (t

20 - 40 seconds

Ramp-Down Rate (T

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Notes for Table 7:

- All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.

Reflow Soldering Characteristics

JEDEC 020c