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MP2166GD Datasheet(PDF) 4 Page - Monolithic Power Systems

Part # MP2166GD
Description  6V, Dual 2A/2A or 3A/1A, Low Quiescent Current, Synchronous Buck with PG and SS
PDF  21 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2166GD Datasheet(HTML) 4 Page - Monolithic Power Systems

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MP2166
– 6V, DUAL 2A/2A OR 3A/1A, SYNC, BUCK REGULATOR WITH PG AND SS
MP2166 Rev. 1.0
www.MonolithicPower.com
4
3/14/2017
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2017 MPS. All Rights Reserved.
PACKAGE REFERENCE
TOP VIEW
1
2
3
4
13
12
11
10
PGND1
SW1
VIN1
FB1
FB2
VIN2
SW2
PGND2
SS1
PG1
FREQ
PG2
SS2
EN2
CCM
AGND
EN1
VCC
5
6
15
14
PGND1
SW1
VIN1
FB1
FB2
VIN2
SW2
PGND2
SS1
PG1
FREQ
PG2
SS2
EN2
CCM
AGND
EN1
VCC
3
4
2
11
10
13
12
1
QFN-18 (2.5mmx3.5mm)
QFN-18 (2mmx3mm)
ABSOLUTE MAXIMUM RATINGS
(1)
Supply voltage (VIN) ....................................6.5V
VSW .......................................-0.3V to VIN + 0.3V
All other pins............................... -0.3V to +6.5V
Junction temperature ............................... 150°C
Lead temperature .................................... 260°C
Continuous power dissipation (TA = +25°C)
(2)
QFN-18 (2mmx3mm) ...............................1.78W
QFN-18 (2.5mmx3.5mm) ...........................2.5W
Recommended Operating Conditions
Supply voltage (VIN) .......................... 2.7V to 6V
Output voltage (VOUT)..................... 0.6V to 5.5V
Operating junction temp........... -40°C to +125°C
Thermal Resistance
(3)
θJA
θJC
QFN-18 (2mmx3mm)..............70……15….°C/W
QFN-18 (2.5mmx3.5mm)........50……12….°C/W
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θ
JA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation produces an excessive die temperature, causing
the regulator to go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7, 4-layer PCB.



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