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LTM4613 Datasheet(PDF) 16 Page - Linear Technology

Part # LTM4613
Description  Low VIN, 10A Step-Down 關Module Regulator
PDF  28 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTM4613 Datasheet(HTML) 16 Page - Linear Technology

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LTM4648
16
4648f
For more information www.linear.com/LTM4648
applicaTions inForMaTion
Run Enable
The RUN pin has an enable threshold of 1.40V maximum,
typically 1.25V with 150mV of hysteresis. It controls the
turn-on of the µModule. The RUN pin can be pulled up to
VIN for 5V operation, or a 5V Zener diode can be placed
on the pin and a 10k to 100k resistor can be placed up to
higher than 5V input for enabling the µModule. The RUN
pin can also be used for output voltage sequencing.
In parallel operation the RUN pins can be tied together and
controlled from a single control. See the Typical Applica-
tion circuits in Figures 20 and 21. The RUN pin can also
be left floating. The RUN pin has a 1µA pull-up current
source that increases to 4.5µA during ramp-up.
Differential Remote Sense Amplifier
An accurate differential remote sense amplifier is provided
in the LTM4648 to sense low output voltages accurately
at the remote load points. This is especially true for high
current loads. It is very important that the DIFFP and
DIFFN are connected properly at the output, and DIFFOUT
is connected to VOUT_LCL. Review the parallel schematics
in Figures 20 and 21.
SW Pins
The SW pin is generally for testing purposes by monitor-
ing the pin. The SW pin can also be used to dampen out
switch node ringing caused by LC parasitic in the switched
current path. Usually a series R-C combination is used
called a snubber circuit. The resistor will dampen the
resonance and the capacitor is chosen to only affect the
high frequency ringing across the resistor.
If the stray inductance or capacitance can be measured or
approximated then a somewhat analytical technique can
be used to select the snubber values. The inductance is
usually easier to predict. It combines the power path board
inductance in combination with the MOSFET interconnect
bond wire inductance.
First the SW pin can be monitored with a wide bandwidth
scope with a high frequency scope probe. The ring fre-
quency can be measured for its value. The impedance Z
can be calculated:
ZL = 2π • f • L
where f is the resonant frequency of the ring, and L is the
total parasitic inductance in the switch path. If a resistor
is selected that is equal to Z, then the ringing should be
dampened. The snubber capacitor value is chosen so that
its impedance is equal to the resistor at the ring frequency.
Calculated by:
ZC =
1
2π • f •C
These values are a good place to start with. Modification
to these components should be made to attenuate the
ringing with the least amount the power loss.
Temperature Monitoring
Measuring the absolute temperature of a diode is pos-
sible due to the relationship between current, voltage
and temperature described by the classic diode equation:
ID = IS • e
VD
η • VT
⎛
⎝⎜
⎞
⎠⎟
or
VD = η• VT •ln
ID
IS
where ID is the diode current, VD is the diode voltage, η is
the ideality factor (typically close to 1.0) and IS (satura-
tion current) is a process dependent parameter. VT can
be broken out to:
VT =
k • T
q
where T is the diode junction temperature in Kelvin, q is
the electron charge and k is Boltzmann’s constant. VT is
approximately 26mV at room temperature (298K) and
scales linearly with Kelvin temperature. It is this linear
temperature relationship that makes diodes suitable
temperature sensors. The IS term in the equation above
is the extrapolated current through a diode junction when
the diode has zero volts across the terminals. The IS term
varies from process to process, varies with temperature,
and by definition must always be less than ID. Combining
all of the constants into one term:
KD =
η • k
q



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