LT3089

26

3089f

For more information www.linear.com/LT3089

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/product/LT3089#packaging for the most recent package drawings.

FE16 (BB) TSSOP REV K 0913

0.09 – 0.20

(.0035 – .0079)

0° – 8°

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

1

3 4 5 6 7 8

10 9

4.90 – 5.10*

(.193 – .201)

16 1514 13 12 11

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

2.94

(.116)

0.195 – 0.30

(.0077 – .0118)

TYP

2

RECOMMENDED SOLDER PAD LAYOUT

0.45 ±0.05

0.65 BSC

4.50 ±0.10

6.60 ±0.10

1.05 ±0.10

2.94

(.116)

3.05

(.120)

3.58

(.141)

3.58

(.141)

4.70

(.185)

MILLIMETERS

(INCHES)

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

SEE NOTE 4

NOTE 5

NOTE 5

6.40

(.252)

BSC

FE Package

16-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663 Rev K)

Exposed Pad Variation BB

5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION

IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED

TRACES OR VIAS ON PBC LAYOUT

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

DETAIL A

DETAIL A IS THE PART OF THE

LEAD FRAME FEATURE FOR

REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.56

(.022)

REF

0.53

(.021)

REF

DETAIL A