STM48-MAIN

STM48-SATELLITE

Rev. 1.0 – 21/02/2018

www.powerstamp.org

Page 28 of 30

belfuse.com/power-solutions

Surface Mount Information

Pick and Place

The Power Stamp modules use an open frame construction and are designed for a fully automated assembly process.

The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label

meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow

temperatures of up to 300°C. The label also carries product information such as product code, serial number and the

location of manufacture.

Nozzle Recommendations

The module weight has been kept to a minimum by using open frame construction. Variables such as nozzle size, tip

style, vacuum pressure and placement speed should be considered to optimize this process. The minimum

recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will

safely fit within the allowable component spacing, is 7 mm.

Bottom Side / First Side Assembly

This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is

attempted, components may fall off the module during the second reflow process.

Lead Free Soldering

The modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free soldering process. Failure

to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect

long-term reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Non-hermetic Solid

State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard

provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package

(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in the Soldering Information section. Soldering outside of the recommended profile requires

testing to verify results and performance.

MSL Rating

The Power Stamp modules have a MSL rating of TBD.

Pre-baking

This component has been designed, handled, and packaged ready for Pb-free reflow soldering. If the assembly shop

follows JSTD-033 Rev. A guidelines, no pre-bake of this component is required before being reflowed to a PCB.

However, if the J-STD-033 Rev A guidelines are not followed by the assembler, Bel recommends that the modules

should be pre-baked @ 120~125

℃foraminimumof4hours(preferably24hours)beforereflowsoldering.

Storage and Handling

The recommended procedures for moisture-sensitive surface mount packages are detailed in J-STD-033 Rev. A.

Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should

not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of <

30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT

packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, <

90% relative humidity.