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The Power Stamp Alliance

Revision History

Date

Revision

Notes

Approved

23/02/2018

1.0

First release

GM

For more information about these products, please consult tech.support@psbel.com

NUCLEAR AND MEDICAL APPLICATIONS

Products are not designed or intended for use as critical components in life support systems, equipment used in

hazardous environments, or nuclear control systems.

TECHNICAL REVISIONS

The appearance of products, including safety agency certifications pictured on labels, may change depending on the

date of manufacturing. Specifications are subject to change without notice.

The Power Stamp Alliance defines a standard product footprint and functions that provide a multiple-sourced,

standard board-mounted solution for power conversion for 48Vin to low voltage, high current applications.

These 48V direct conversion DC-DC modules - or 'power stamps' - primarily target devices being used in large data

centers (e.g. CPU, DDR, FPGA, ASIC), many of which are following the principles of the Open Compute Project

(OCP).

Some of the first processor architectures addressed by the Power Stamp Alliance are the Intel VR13 Skylake CPUs,

Intel VR13-HC Ice Lake CPUs, DDR4 memories, IBM POWER9 (P9) architecture processors and devices using the

PMBus AVS protocol or SVID protocol.

48V single stage power conversion offers Open Compute Project and data center companies a range of business

and technical benefits.

www.powerstamp.org