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AD8115ASTZ Datasheet(PDF) 8 Page - Analog Devices |
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AD8115ASTZ Datasheet(HTML) 8 Page - Analog Devices |
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8 / 25 page ![]() AD8114/AD8115 Data Sheet Rev. C | Page 8 of 25 ABSOLUTE MAXIMUM RATINGS Table 7. Parameter Rating Supply Voltage 12.0 V Internal Power Dissipation1 AD8114/AD8115 100-Lead Plastic LQFP (ST) 2.6 W Input Voltage ±VS Output Short-Circuit Duration Observe power derating curves Storage Temperature Range2 −65°C to +125°C 1 Specification is for device in free air (TA = 25°C). 100-lead plastic LQFP (ST): θJA = 40°C/W. 2 Maximum reflow temperatures are to JEDEC industry standard J-STD-020. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8114/AD8115 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 125°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 125°C for an extended period can result in device failure. While the AD8114/AD8115 are internally short-circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (125°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 5. TJ = 125°C AMBIENT TEMPERATURE ( °C) 5 4 3 2 1 0 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 Figure 5. Maximum Power Dissipation vs. Temperature ESD CAUTION |
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