TMUX6113 datasheet(4/26 Pages) TI1

4 / 26 page

TMUX6111, TMUX6112, TMUX6113

SCDS383 – AUGUST 2018

www.ti.com

Product Folder Links: TMUX6111 TMUX6112 TMUX6113

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD to VSS

Supply voltage

VDD to GND

–0.3

VSS to GND

–18

0.3

VDIG

Digital input pin (SEL1, SEL2, SEL3, SEL4) voltage

GND –0.3

VDD+0.3

IDIG

Digital input pin (SEL1, SEL2, SEL3, SEL4) current

–30

VANA_IN

Analog input pin (Sx) voltage

VSS–0.3

VDD+0.3

IANA_IN

Analog input pin (Sx) current

–30

VANA_OUT

Analog output pin (D) voltage

VSS–0.3

VDD+0.3

IANA_OUT

Analog output pin (D) current

–30

Ambient temperature

–55

150

°C

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

7.3 Thermal Information

THERMAL METRIC

TMUX6111/ TMUX6112/ TMUX6113

UNIT

PW (TSSOP)

RTE (QFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

111.0

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.7

TBD

°C/W

RθJB

Junction-to-board thermal resistance

57.2

TBD

°C/W

ΨJT

Junction-to-top characterization parameter

4.1

TBD

°C/W

ΨJB

Junction-to-board characterization parameter

56.6

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W

(1)

VDD and VSS can be any value as long as 10 V ≤ (VDD – VSS) ≤ 33 V.

(2)

VS is the voltage on all the S pins.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD to VSS

(1)

Power supply voltage differential

VDD to GND

Positive power supply voltage (singlle supply, VSS = 0 V)

16.5

VDD to GND

Positive power supply voltage (dual supply)

16.5

VSS to GND

Negative power supply voltage (dual supply)

–5

–16.5

(2)

Source pins voltage

VSS

VDD

TMUX6113 Datasheet(PDF) 4 Page - Texas Instruments

TMUX6113 Datasheet(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Datasheet Download

Link URL