ADV7630 datasheet(8/16 Pages) AD

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ADV7630

Data Sheet

Rev. 0 | Page 8 of 16

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

CVDD to GND

2.2 V

DVDD to GND

2.2 V

TVDD to GND

3.9 V

TX_AVDD to GND

2.2 V

TXA_PVDD to GND

2.2 V

TXB_PVDD to GND

2.2 V

SYS_3P3V to GND

3.9 V

DVDDIO to GND

3.9 V

Digital Inputs Voltage to GND

GND – 0.3 V to DVDDIO + 0.3 V

Analog Inputs Voltage to GND

GND – 0.3 V to TXA_PVDD + 0.3 V

HDMI Digital Inputs Voltage to GND

GND – 0.3 V to TVDD + 0.3 V

5 V Tolerant Digital Inputs to

GND1, 3, 6

GND – 0.3 V to 5.5 V

5 V Digital Inputs2

5 V Tolerant Digital Outputs to GND3,6

GND – 0.3 V to 5.5 V

Digital Outputs Voltage to GND4, 5

GND – 0.3 V to DVDDIO + 0.3 V

Analog Outputs Voltage to GND

GND – 0.3 V to CVDD + 0.3 V

HDMI Digital Outputs to GND

GND – 0.3 V to TVDD + 0.3 V

Maximum Junction Temperature

(TJ MAX)

125°C

Storage Temperature Range

−60°C to +150°C

Infrared Reflow Soldering (20 sec)

260°C

1 The following pins are 3.3 V inputs, 5 V tolerant: TXB_HPD, TXB_DDC_SDA, ,

TXA_HPD, TXA_DDC_SDA, DDCA_SCL, DDCB_SCL, DDCC_SCL, DDCD_SCL.

2 The following pins are 5 V inputs: RXA_5V, RXB_5V, RXC_5V, RXD_5V.

3 The following pins are 3.3 V outputs, 5 V tolerant: TXB_DDC_SCL,

TXA_DDC_SCL, HPA_D, HPA_C, HPA_B, HPA_A.

4 Except the DDCA_SDA, DDCB_SDA, DDCC_SDA, DDCD_SDA, EP_MOSI,

EP_SCK, and EP_CS pins, which are kept to GND – 0.3 V to REG_3P3V.

5 Except the REG_3P3V output, which is kept to GND – 0.3 V to SYS_3P3 +

0.3 V and REG_1P8V output, which is kept to GND – 0.3 V to DVDD + 0.3 V.

6 The following pins are 3.3 V bidirectional input/outputs, 5 V tolerant:

TXA_DDC_SDA, TXB_DDC_SDA, DDCA_SDA, DDCB_SDA, DDCC_SDA, and

DDCD_SDA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

PACKAGE THERMAL PERFORMANCE

To reduce power consumption when using the ADV7630, the

user is advised to turn off the unused sections of the part.

Due to PCB metal variation and, therefore, variation in PCB

heat conductivity, the value of θJA may differ for various PCBs.

The most efficient measurement solution is obtained using

the package surface temperature to estimate the die tempera-

ture because this eliminates the variance associated with the

θJA value.

The maximum junction temperature (TJ MAX) of 125°C must not

be exceeded. The following equation calculates the junction

temperature using the measured package surface temperature

and applies only when no heat sink is used on the device under

test (DUT):





TOTAL







where:

TS is the package surface temperature (°C).

ΨJT is 0.22°C/W for the 128-lead TQFP_EP.

WTOTAL = ((CVDD × ICVDD) + (0.2 × TVDD × ITVDD) + (DVDD ×

IDVDD) + (TX_AVDD × ITX_AVDD) + (TXA_PVDD × ITXA_PVDD) +

(TXB_PVDD × ITXA_PVDD) + (DVDDIO × IDVDDIO)) + NTX × PTX

where:

0.2 is 20% of the TVDD power that is dissipated on the part

itself.

NTX is the number of connected and active TX ports.

PTX = 28 mW minus average power dissipated on-chip of each

HDMI transmitters.

ESD CAUTION

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