4

OPA2156

SBOS900 – SEPTEMBER 2018

www.ti.com

Product Folder Links: OPA2156

Submit Documentation Feedback

Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings

only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended

Operating Conditions . Exposure to absolute-maximum-rated conditions for extendedperiods may affect device reliability.

(2)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

±20

(+40, single supply)

V

Signal input pins

Voltage

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

0.5

Current

±10

mA

Continuous

Temperature

Operating junction

–40

150

°C

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

OPA2156

±2500

V

OPA2156

Charged-device model (CDM), per JEDEC specification JESD22-

±500

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

4.5 (±2.25)

36 (±18)

V

Specified junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information: OPA2156

OPA2156

UNIT

8 PINS

D (SOIC)

Junction-to-ambient thermal resistance

120

°C/W

Junction-to-case(top) thermal resistance

51.8

°C/W

Junction-to-board thermal resistance

65.4

°C/W

Junction-to-top characterization parameter

10.0

°C/W

Junction-to-board characterization parameter

64.2

°C/W