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MHT1108N Datasheet(PDF) 2 Page - NXP Semiconductors |
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MHT1108N Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 15 page ![]() 2 RF Device Data NXP Semiconductors MHT1108N Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS –0.5, +65 Vdc Gate--Source Voltage VGS –6.0, +10 Vdc Operating Voltage VDD 32, +0 Vdc Storage Temperature Range Tstg –65 to +150 °C Case Operating Temperature Range TC –40 to +150 °C Operating Junction Temperature Range (1,2) TJ –40 to +150 °C Total Device Dissipation @ TC =25°C Derate above 25°C PD 32.9 0.26 W W/°C Table 2. Thermal Characteristics Characteristic Symbol Value (2,3) Unit Thermal Resistance, Junction to Case Case Temperature 97°C, 12.6 W CW, 28 Vdc, IDQ = 110 mA, 2450 MHz RθJC 3.8 °C/W Table 3. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22--A114) 1C, passes 1000 V Charge Device Model (per JESD22--C101) C3, passes 1000 V Table 4. Moisture Sensitivity Level (MSL) Test Methodology Rating Package Peak Temperature Unit Per JESD22--A113, IPC/JEDEC J--STD--020 3 260 °C Table 5. Electrical Characteristics (TA =25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Off Characteristics Zero Gate Voltage Drain Leakage Current (VDS =65 Vdc, VGS =0 Vdc) IDSS — — 10 μAdc Zero Gate Voltage Drain Leakage Current (VDS =32 Vdc, VGS =0 Vdc) IDSS — — 1 μAdc Gate--Source Leakage Current (VGS =5 Vdc, VDS =0 Vdc) IGSS — — 1 μAdc On Characteristics Gate Threshold Voltage (VDS =10 Vdc, ID = 14.3 μAdc) VGS(th) 0.8 1.2 1.6 Vdc Gate Quiescent Voltage (VDS =28 Vdc, ID =90 mAdc) VGS(Q) — 1.8 — Vdc Drain--Source On--Voltage (VGS =10 Vdc, ID = 143 mAdc) VDS(on) 0.1 0.2 0.3 Vdc 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at http://www.nxp.com/RF/calculators. 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.nxp.com/RF and search for AN1955. |
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